Fluxless Soldering of Laminated Thin Metal Plates Using Au-Sn Alloy Solder.
نویسندگان
چکیده
منابع مشابه
Fluxless silicon-to-alumina bonding using electroplated Au–Sn–Au structure at eutectic composition
Large 6 mm× 9 mm silicon chips have been successfully bonded to alumina substrates with electroplated Au/Sn/Au structure at the eutectic omposition. The new bonding process is entirely fluxless, or flux-free. It is performed in vacuum (50 milliTorrs), where the oxygen content is educed by a factor of 15,200 comparing to air, to inhibit solder oxidation. Eutectic Au80Sn20 alloy is a well establi...
متن کاملEffect of Thermal Aging on the Impact Strength of Soldered Bumps under Formic Acid Atmosphere
In this study, we have investigated the effect of thermal aging on impact strength of Sn-Ag-Cu solder bumps in fluxless soldering process using formic acid atmosphere. We conducted impact tests on as-reflowed and thermally-aged solder bumps, which were fabricated on either formic acid atmosphere or a liquid flux. The results indicated that the morphology of the intermetallic compound layers in ...
متن کاملFree vibration analysis of variable stiffness composite laminated thin skew plates using IGA
A NURBS-based isogeometric finite element formulation is developed and adopted to the free vibration analysis of finite square and skew laminated plates. Variable stiffness plies are assumed due to implementation of curvilinear fiberreinforcements. It is assumed due to employment of tow placement technology, in each ply of variable stiffness composite laminated plate the fiber reinforceme...
متن کاملSoldering Characteristics and Mechanical Properties of Sn-1.0Ag-0.5Cu Solder with Minor Aluminum Addition
Driven by the trends towards miniaturization in lead free electronic products, researchers are putting immense efforts to improve the properties and reliabilities of Sn based solders. Recently, much interest has been shown on low silver (Ag) content solder SAC105 (Sn-1.0Ag-0.5Cu) because of economic reasons and improvement of impact resistance as compared to SAC305 (Sn-3.0Ag-0.5Cu. The present ...
متن کاملMechanical Properties and Solder Joint Reliability of Low-Melting Sn-Bi-Cu Lead Free Solder Alloy
The influence of alloy composition of lowmelting Sn-Bi-Cu lead-free solder alloys on mechanical properties and solder joint reliabilities were investigated. The mechanically optimum alloy composition is Sn-40Bi-0.1Cu (mass%). The addition of 40mass%Bi improves the ductility and restrains the fillet-lifting, which are problems of lead-free solders with Bi. The addition of copper improves both th...
متن کاملذخیره در منابع من
با ذخیره ی این منبع در منابع من، دسترسی به آن را برای استفاده های بعدی آسان تر کنید
ژورنال
عنوان ژورنال: QUARTERLY JOURNAL OF THE JAPAN WELDING SOCIETY
سال: 1997
ISSN: 0288-4771
DOI: 10.2207/qjjws.15.38